- S. Xu, X. Zhu, H. Kotadia, S.H. Mannan, H. Lu, C. Bailey, Y.C. Chan, Remedies to control electromigration: Ag/Ni nano doped and CNT doped Cu interconnects.62nd Electronic Components and Technology Conference (ECTC),
- S. Xu, Y.C. Chan, X. Zhu, H. Lu, C. Bailey, Effective Method to Disperse and Incorporate Carbon Nanotube in Electroless Ni-P Alloy Deposits.64th Electronic Components and Technology Conference (ECTC),
- S. Xu, Y.C. Chan, Q. Li, I. Shafiq, Computational Study of Mechanical Properties and Electromigration in Nanoscale Cu/Sn/Cu and Cu/Sn-Bi/Cu Solder Joints.International Conference on Electronic Packaging (ICEP),
- L. Huang, M Jiang,X. Xu, J. Chen, S. Xu*, Y. Cao, The Influence of Heterogeneous RDL on the RF characteristic of Millimeter wave Phased Array Microsystem.24th International Conference on Electronic Packaging Technology (ICEPT),
- X. Hu, S. Xu, Y. Yang, Z. Chen, Y.C. Chan, Effect of TiO2 nanoparticle addition on electroless Ni–P under bump metallization for lead-free solder interconnection.Materials Science & Engineering A,
- X. Zhu, H. Kotadia, S. Xu, H. Lu, S.H. Mannan, C. Bailey, Y.C. Chan, Electromigration in Sn–Ag solder thin films under high current density.Thin Solid Films,
- X. Zhu, H. Kotadia, S. Xu, H. Lu, S.H. Mannan, C. Bailey, Y.C. Chan, Modeling Electromigration for Microelectronics Design.Journal of Computational Science and Technology,
- W. Deng, S. Xu,Z. Xu, S. Zhu, Automated Design of Millimeter-wave Dielectric Transmitarray Antenna Using Tandem Network.IEEE Antennas and Wireless Propagation Letters,
- E. He, Z. Zhang, S. Xu, A GaN HEMT 6-Bit Digital Phase Shifter for Millimeter Wave Phased Array System.2022 IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications (IMWS-AMP),
- Z. Chen,H. Zhu,J. Zhang, Z. Chen, S. Xu, Z. Zhang, A Cost-Effective Over-the-Air Test Verification Method for 5G Active Antennas.2022 International Conference on Microwave and Millimeter Wave Technology (ICMMT),