S. Xu, X. Zhu, H. Kotadia, S.H. Mannan, H. Lu, C. Bailey, Y.C. Chan, Remedies to control electromigration: Ag/Ni nano doped and CNT doped Cu interconnects
Release time:2024-03-17 Hits:
Journal:62nd Electronic Components and Technology Conference (ECTC)
Translation or Not:no