X. Hu, S. Xu, Y. Yang, Z. Chen, Y.C. Chan, Effect of TiO2 nanoparticle addition on electroless Ni–P under bump metallization for lead-free solder interconnection
Release time:2024-03-17 Hits:
Journal:Materials Science & Engineering A
Translation or Not:no
Pre One:L. Huang, M Jiang,X. Xu, J. Chen, S. Xu*, Y. Cao, The Influence of Heterogeneous RDL on the RF characteristic of Millimeter wave Phased Array Microsystem
Next One:X. Zhu, H. Kotadia, S. Xu, H. Lu, S.H. Mannan, C. Bailey, Y.C. Chan, Electromigration in Sn–Ag solder thin films under high current density