X. Hu, S. Xu, Y. Yang, Z. Chen, Y.C. Chan, Effect of TiO2 nanoparticle addition on electroless Ni–P under bump metallization for lead-free solder interconnection
Release time:2024-03-17 Hits:
Journal:Materials Science & Engineering A
Translation or Not:no
Pre One:S. Xu, Y.C. Chan, Q. Li, I. Shafiq, Computational Study of Mechanical Properties and Electromigration in Nanoscale Cu/Sn/Cu and Cu/Sn-Bi/Cu Solder Joints
Next One:X. Hu, S. Xu, Y. Yang, Z. Chen, Y.C. Chan, Effect of TiO2 nanoparticle addition on electroless Ni–P under bump metallization for lead-free solder interconnection