S. Xu, Y.C. Chan, Q. Li, I. Shafiq, Computational Study of Mechanical Properties and Electromigration in Nanoscale Cu/Sn/Cu and Cu/Sn-Bi/Cu Solder Joints
Release time:2024-03-18 Hits:
Journal:International Conference on Electronic Packaging (ICEP)
Translation or Not:no
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