- X. Zhu, H. Kotadia, S. Xu, H. Lu, S.H. Mannan, C. Bailey, Y.C. Chan, Modeling Electromigration for Microelectronics Design.Journal of Computational Science and Technology,
- W. Deng, S. Xu,Z. Xu, S. Zhu, Automated Design of Millimeter-wave Dielectric Transmitarray Antenna Using Tandem Network.IEEE Antennas and Wireless Propagation Letters,
- E. He, Z. Zhang, S. Xu, A GaN HEMT 6-Bit Digital Phase Shifter for Millimeter Wave Phased Array System.2022 IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications (IMWS-AMP),
- Z. Chen,H. Zhu,J. Zhang, Z. Chen, S. Xu, Z. Zhang, A Cost-Effective Over-the-Air Test Verification Method for 5G Active Antennas.2022 International Conference on Microwave and Millimeter Wave Technology (ICMMT),
- Z. Chen, S. Xu, H. Zhu,W. Feng, W. Che, Q. Xue, High-performance Millimeter-Wave Front-end Module Using LTCC Technology.23rd International Conference on Electronic Packaging Technology (ICEPT),
- L. Yang, Q. He, Z. Chen, S. Xu, J. Zhang, Multi-Mode Wideband Filtering Antenna for 5G Millimeter-Wave Communication.2021 IEEE International Workshop on Electromagnetics: Applications and Student Innovation Competition (iWEM),
- Z. Chen, Z. Hu, Z. Du, S. Xu, J. Zhang, G. Zhang, Normal-Mode Circularly Polarized Helix Antenna and Its Application to End-Fire Array.2021 IEEE International Workshop on Electromagnetics: Applications and Student Innovation Competition (iWEM),
- Z. Chen, J. Zhang, Z. Chen, B. Sun, S. Xu, C. Guo, An Antenna in Package for 5G mmWave Application,.21st International Conference on Electronic Packaging Technology (ICEPT),
- X. Zhu, H. Kotadia, S. Xu, H. Lu, S. H. Mannan, C. Bailey, and Y.C. Chan,Multi-Physics Computer Simulation of the Electromigration Phenomenon.International Conference on Electronic Packaging Technology and High Density Packaging,
- I. Shafiq, Y.C. Chan, S. Xu, Q. Li, Electro-migration Study of Nano Al Doped Lead- Free Sn-58Bi on Cu and AulNi/Cu Ball Grid Array (BGA) packages.18th European Microelectronics & Packaging Conference,