- X. Yang, X. Huang, M. Zhu, S. Xu*, Y. Liu, Ensemble and Random RX With Multiple Features Anomaly Detector for Hyperspectral Image.IEEE Geoscience and Remote Sensing Letters,
- Y. Weng, W. Feng, S. Xu*, G. Shen, Y. Shi, W. Che, Wideband quasi-reflectionless bandstop filters using open/shorted coupled lines.International Journal of Microwave and Wireless Technologies,
- 赖星锦, 郑致远,杜晓颜, 徐 莎* ,杨晓君, 基于超像素锚图二重降维的高光谱聚类算法.计算机应用,
- S. Xu, D. Shi, C. Guo, A TGV-based Antenna in Package for 5G mm-Wave Application.22nd International Conference on Electronic Packaging Technology (ICEPT),
- S. Xu, X. Zhu, H. Kotadia, S.H. Mannan, H. Lu, C. Bailey, Y.C. Chan, Remedies to control electromigration: Ag/Ni nano doped and CNT doped Cu interconnects.62nd Electronic Components and Technology Conference (ECTC),
- S. Xu, Y.C. Chan, X. Zhu, H. Lu, C. Bailey, Effective Method to Disperse and Incorporate Carbon Nanotube in Electroless Ni-P Alloy Deposits.64th Electronic Components and Technology Conference (ECTC),
- S. Xu, Y.C. Chan, Q. Li, I. Shafiq, Computational Study of Mechanical Properties and Electromigration in Nanoscale Cu/Sn/Cu and Cu/Sn-Bi/Cu Solder Joints.International Conference on Electronic Packaging (ICEP),
- L. Huang, M Jiang,X. Xu, J. Chen, S. Xu*, Y. Cao, The Influence of Heterogeneous RDL on the RF characteristic of Millimeter wave Phased Array Microsystem.24th International Conference on Electronic Packaging Technology (ICEPT),
- X. Hu, S. Xu, Y. Yang, Z. Chen, Y.C. Chan, Effect of TiO2 nanoparticle addition on electroless Ni–P under bump metallization for lead-free solder interconnection.Materials Science & Engineering A,
- X. Zhu, H. Kotadia, S. Xu, H. Lu, S.H. Mannan, C. Bailey, Y.C. Chan, Electromigration in Sn–Ag solder thin films under high current density.Thin Solid Films,