W. Yang, H. Lu, Y. He, H. Yang, S. Xu*, C. Guo, Thermal Reliability Analysis and Optimization of Millimeter-Wave Multi-Chip RF Front-End Modules based on Heterogeneous HDI substrate
Release time:2025-07-09 Hits:
Journal:2025 26th International Conference on Electronic Packaging Technology (ICEPT)
Translation or Not:no
