Paper Publications

W. Yang, H. Lu, Y. He, H. Yang, S. Xu*, C. Guo, Thermal Reliability Analysis and Optimization of Millimeter-Wave Multi-Chip RF Front-End Modules based on Heterogeneous HDI substrate

Release time:2025-07-09  Hits:

Journal:2025 26th International Conference on Electronic Packaging Technology (ICEPT)

Translation or Not:no

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