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2. 面向半导体先进封装XXXX对焦系统研发,技术开发委托项目,100万,2026-2027
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3. LDI机数字掩模自适应分块及自检算法开发,技术开发委托项目,2026
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1. 混合键合XXXX对位系统研制,技术开发合作项目,450万,2026-2028
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