9. Nian Cai*, Guandong Cen, Jixiu Wu, Feiyang Li, Han Wang, Xindu Chen. SMT solder joint inspection via a novel cascaded convolutional neural network. IEEE Transactions on Components, Packaging and Manufacturing Technology, Apr. 2018, 8 (4): 670-677,
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上一条： 8. Qian Ye, Nian Cai*, Jiaming Li, Feiyang Li, Han Wang, Xindu Chen. IC solder joint inspection based on an adaptive-template method. IEEE Transactions on Components, Packaging and Manufacturing Technology, June 2018, 8 (6): 1121-1127
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