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个人信息Personal Information
副教授
硕士生导师
教师拼音名称：XU SHA
所在单位：集成电路学院
性别：女
在职信息：在职
X. Hu, S. Xu, Y. Yang, Z. Chen, Y.C. Chan, Effect of TiO2 nanoparticle addition on electroless Ni–P under bump metallization for lead-free solder interconnection
点击次数：
发表刊物：Materials Science & Engineering A
是否译文：否
上一条：L. Huang, M Jiang,X. Xu, J. Chen, S. Xu*, Y. Cao, The Influence of Heterogeneous RDL on the RF characteristic of Millimeter wave Phased Array Microsystem
下一条：X. Zhu, H. Kotadia, S. Xu, H. Lu, S.H. Mannan, C. Bailey, Y.C. Chan, Electromigration in Sn–Ag solder thin films under high current density