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黄李昌，许校彬，江镘楷，许梓雄，陈金星，曹云飞，三维相控阵天线封装及其制备方法，CN117394015A，发明专利，授权

Release time:2024-03-18  Hits:

Service Invention or Not:no

Pre One:黄李昌，童玉婷，曹云飞，许校彬，陈金星，基于玻璃通孔技术的毫米波封装天线的仿真方法及装置，CN117454723A，发明专利，授权 Next One:张俊，何启明，朱红博，杨立森，徐莎，陈卓著，一种基于扇出封装工艺的毫米波封装天线，CN114122674A，发明专利，申请

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