Patents

张俊,何启明,朱红博,杨立森,徐莎,陈卓著,一种基于扇出封装工艺的毫米波封装天线,CN114122674A,发明专利,申请

Release time:2024-03-18  Hits:

Service Invention or Not:no

Guangdong University of Technology Tel:020-39323866
Copyright @ 2020-2021 All rights reserved. Guangdong ICP No. 05008833

Click:| The Last Update Time:--| Open time:-- |MOBILE Version