是否译文:否
是否译文:否
上一条:(17) Yan, Q. S.,Chen, S. K.,Pan, J. S.(*),Lu, J. B.,Liu, Q.,The surface and subsurface damage characteristics and material removal mechanism in 6H-SiC wafer grinding,Materials Research Innovations,2014,18:742~747 SCI四区 下一条:(19) 路家斌,阎秋生,潘继生,高伟强,电磁流变效应微磨头加工的电磁耦合协同作用机理实验,光学精密工程,2012 , 20 (11) :2485-2491 EI收录