广东工业大学教师主页平台管理系统 Jisheng PAN--Home-- (18) QiuSheng Yan，Senkai Chen，Jisheng Pan(*)，Detection and Analysis of Subsurface Cracks of Single Crystal SiC Wafers Based on Cross-Sectional Microscopy Method，Advanced Materials Research，2014(1027)：240~245 EI收录

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(18) QiuSheng Yan，Senkai Chen，Jisheng Pan(*)，Detection and Analysis of Subsurface Cracks of Single Crystal SiC Wafers Based on Cross-Sectional Microscopy Method，Advanced Materials Research，2014(1027)：240~245 EI收录

Release time:2021-03-05 Hits:

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Pre One:(17) Yan, Q. S.，Chen, S. K.，Pan, J. S.(*)，Lu, J. B.，Liu, Q.，The surface and subsurface damage characteristics and material removal mechanism in 6H-SiC wafer grinding，Materials Research Innovations，2014,18：742~747 SCI四区 Next One:(19) 路家斌，阎秋生，潘继生，高伟强，电磁流变效应微磨头加工的电磁耦合协同作用机理实验，光学精密工程，2012 , 20 (11) :2485-2491 EI收录