广东工业大学教师主页平台管理系统 Jisheng PAN--Home-- (17) Yan, Q. S.，Chen, S. K.，Pan, J. S.(*)，Lu, J. B.，Liu, Q.，The surface and subsurface damage characteristics and material removal mechanism in 6H-SiC wafer grinding，Materials Research Innovations，2014,18：742~747 SCI四区

Jisheng PAN

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(17) Yan, Q. S.，Chen, S. K.，Pan, J. S.(*)，Lu, J. B.，Liu, Q.，The surface and subsurface damage characteristics and material removal mechanism in 6H-SiC wafer grinding，Materials Research Innovations，2014,18：742~747 SCI四区

Release time:2021-03-05 Hits:

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Pre One:(16) Peng Yu，Jisheng Pan(*)，Qiusheng Yan，Magnetorheological finishing with tangential magnetic fields formed by the rotation of a magnetic pole，International Journal of Abrasive Technology，2016,7（4）：307~320 EI收录 Next One:(18) QiuSheng Yan，Senkai Chen，Jisheng Pan(*)，Detection and Analysis of Subsurface Cracks of Single Crystal SiC Wafers Based on Cross-Sectional Microscopy Method，Advanced Materials Research，2014(1027)：240~245 EI收录