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个人信息Personal Information
副教授
硕士生导师
教师拼音名称：XU SHA
所在单位：集成电路学院
性别：女
在职信息：在职
S. Xu, X. Hu, Y. Yang, Z. Chen, Y.C. Chan, Effect of carbon nanotubes and their dispersion on electroless Ni–P under bump metallization for lead-free solder interconnection
点击次数：
发表刊物：Materials Science and Engineering: A Structural Materials: Properties, Microstructure and Processing
是否译文：否
上一条：S. Xu, H. Zhu and W. Feng，A wide-band balanced-to-unbalanced power divider using microstrip-slotline-SIW transitions
下一条：S. Xu, Y.C. Chan, K. Zhang, K.C. Yung, Interfacial intermetallic growth and mechanical properties of carbon nanotubes reinforced Sn3.5Ag0.5Cu solder joint under current stressing