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徐莎，郭春炳，张俊，一种半导体封装结构，CN113410181B，发明专利，授权，已转让

Release time:2024-03-18  Hits:

Service Invention or Not:no

Pre One:Y. Sun, S. Xu, Y.S. Kin, Alternate Plating and Etching Processes for Through Hole Filling, US9991161 B1, 美国专利，授权 Next One:胡明涛，徐莎，郭春炳，相控阵封装天线及其制作方法，CN117543226A，发明专利，授权

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