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孙耀峰，徐莎，邱树坚，用于通孔填充的交替电镀和蚀刻过程，CN107820731B，发明专利，授权

Release time:2024-03-18  Hits:

Service Invention or Not:no

Pre One:胡明涛，徐莎，郭春炳，相控阵封装天线及其制作方法，CN117543226A，发明专利，授权 Next One:孙耀峰，徐莎，用于电镀液分析的静态圆盘电极，CN106461603B，发明专利，授权

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