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I. Shafiq, Y.C. Chan, S. Xu, Q. Li, Electro-migration Study of Nano Al Doped Lead- Free Sn-58Bi on Cu and AulNi/Cu Ball Grid Array (BGA) packages

Release time:2024-03-17  Hits:

Journal:18th European Microelectronics & Packaging Conference

Translation or Not:no

Pre One:X. Zhu, H. Kotadia, S. Xu, H. Lu, S. H. Mannan, C. Bailey, and Y.C. Chan,Multi-Physics Computer Simulation of the Electromigration Phenomenon Next One:X. Zhu, H. Kotadia, S. Xu, H. Lu, S. H. Mannan, C. Bailey, and Y.C. Chan, Electromigration Aware Design for Nano-packaging

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