Research Projects

以接枝聚合物作为硅通孔绝缘材料的技术开发,HKITF, 280万元,参与

Release time:2024-03-15  Hits:

Date of Project Approval:2016-03-01

Scheduled completion time:2016-12-31

Subsidy Amount:280.0

Guangdong University of Technology Tel:020-39323866
Copyright @ 2020-2021 All rights reserved. Guangdong ICP No. 05008833

Click:| The Last Update Time:--| Open time:-- |MOBILE Version