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基于第三代化合物半导体的射频前端系统技术，科技部重点研发，4647万元，参与

Release time:2024-03-15  Hits:

Project Number:2018YFB1802100

Date of Project Approval:2019-07-01

Scheduled completion time:2023-06-30

Subsidy Amount:4647.0

Pre One:芯片基板压合过程应力仿真，企业委托，主持 Next One:兼容C波段的毫米波一体化射频前端系统关键技术，科技部重点研发，3616万元，参与

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