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芯片基板压合过程应力仿真，企业委托，主持

Release time:2024-03-14  Hits:

Date of Project Approval:2023-03-13

Scheduled completion time:2025-03-13

Pre One:NANDFLASH 存储芯片测试程序设计方案，企业委托，主持 Next One:基于第三代化合物半导体的射频前端系统技术，科技部重点研发，4647万元，参与

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