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高密度毫米波封装中玻璃通孔电磁损耗机理研究，省部级，主持

Release time:2024-03-14  Hits:

Project Number:202201010275

Date of Project Approval:2022-04-01

Scheduled completion time:2024-03-31

Subsidy Amount:5.0

Pre One:高密度三维异构相控阵微系统集成关键技术研究，NSFC面上项目，49万元，主持 Next One:玻璃基通孔互连的损耗研究及在封装天线中的应用，重点实验室开放课题，主持

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