Doctor of Engineering
PhD
Date of Employment:2017-12-04
Email :
Translation or Not:no
Pre One:[2] SL Pang, MY Chen*, SW Ta , H Wu , K Takamasu. Void and solder joint detection for chip resistors based on X-ray images and deep neural networks. Microelectronics Reliability, 2022,135: 114587.（Q2） Next One:[4] MY Chen, SL Pang , JL Zhou, H Wu, H Matsumoto, K Takamasu. High-accuracy spectral interferometer with multi-Fabry–Perot Etalon for thickness measurement of the silicon wafer[J]. Optics Communications, 2021,501,127346.（Q2）
