19. Nian Cai*, Qian Ye, Gen Liu, Han Wang, Zhijing Yang. IC solder joint inspection based on the Gaussian mixture model. Soldering & Surface Mount Technology, 2016, 28 (4): 207-214
- Translation or Not:no
Pre One: 7. Qian Ye, Nian Cai*, Hao Xia, Guandong Cen, Xindu Chen, Han Wang. An effective optimization scheme for ECG signal denoising via low-rank matrix decomposition. Circuits, Systems and Signal Processing, Jan. 2019, 38 (1): 138-152
Next One:9. Nian Cai*, Guandong Cen, Jixiu Wu, Feiyang Li, Han Wang, Xindu Chen. SMT solder joint inspection via a novel cascaded convolutional neural network. IEEE Transactions on Components, Packaging and Manufacturing Technology, Apr. 2018, 8 (4): 670-677,

