17. Nian Cai, Yang Zhou, Qian Ye, Gen Liu, Han Wang, Xindu Chen. IC solder joint inspection via robust principle component analysis. IEEE Transactions on Components, Packaging and Manufacturing Technology, Feb. 2017, 7 (2): 300-309
- Translation or Not:no
Pre One: 21. Nian Cai, Jianfa Lin, Qian Ye, Han Wang, Shaowei Weng, Bingo Wing-Kuen Ling. A new IC solder joint inspection method for an automatic optical inspection system based on an improved visual background extraction algorithm. IEEE Transactions on Components, Packaging and Manufacturing Technology, 2016, 6 (1): 161-172.
Next One:23. Nian Cai, Nannan Zhu, Shaowei Weng, Bingo Wing-Kuen Ling. Difference angle quantization index modulation scheme for image watermarking. Signal Processing: Image Communication, 2015, 34: 52-60