[2] SL Pang, MY Chen*, SW Ta , H Wu , K Takamasu. Void and solder joint detection for chip resistors based on X-ray images and deep neural networks. Microelectronics Reliability, 2022,135: 114587.(Q2)
点击次数:
是否译文:否
上一条: [1] JB Chen, MY Chen*, H Wu, Xie SL, K Takamasu. Distortion spot correction and center location base on deep neural network and MBAS in measuring large curvature aspheric optical element. Optics Express, 2022, 30:30466-30479.(Q1)
下一条: [3] MY Chen, ZY Zhang, H Wu, SL Xie, H Wang. Otsu-Kmeans gravity-based multi-spots center extraction method for microlens array imaging system [J]. Optics and Lasers in Engineering, 2022,152: 106968.(Q1)